Ibhodi lokulawula lemojuli entsha ye-ASM SMT SIPLACE TX yomshini wokubekwa kwe-ASM

Ukukhweza kwe-ASM kuwumgomo ovaliwe wokusebenza.Uma izinga lebhodi ku-mounter lingazinzile, Ngenxa yalokho, inhloko esebenzayo ye-mounter ayikwazi ukubuyela endaweni yokubhekisela, ngakho-ke ayikho indlela yokukhiqiza okuvamile.Imishini ingasebenza ngokujwayelekile kuphela uma inkinga yekhwalithi yebhodi itholakala futhi ilungiswa ngesikhathi sokuqala.

Ubuchwepheshe be-Surface-Mountain (SMT) yindlela lapho izingxenye zikagesi zigxunyekwa khona ngqo phezu kwebhodi lesekethe eliphrintiwe (PCB).... Ingxenye ye-SMT ivamise ukuba yincane kunozakwabo we- through-hole ngoba inomkhondo omncane noma ayinawo nhlobo.

Ingxenye kagesi efakwe ngale ndlela ibizwa ngokuthi i-surface-mount device (SMD).Embonini, le ndlela ngokuyinhloko ithathe indawo yokwakhiwa kobuchwepheshe bembobo yezingxenye ezifanele, ingxenye enkulu ngoba i-SMT ivumela ukwanda kokukhiqiza okuzenzakalelayo okunciphisa izindleko futhi kuthuthukise ikhwalithi.Iphinde ivumele izingxenye ezengeziwe ukuthi zilingane endaweni ethile ye-substrate.Bobabili ubuchwepheshe bungasetshenziswa ebhodini elifanayo, ngobuchwepheshe be- through-hole obuvame ukusetshenziselwa izingxenye ezingafanele ukukhwezwa phezulu njengama-transformer amakhulu kanye nama-semiconductors amandla acwilisiwe.

Ingxenye ye-SMT ivamise ukuba yincane kunozakwabo we- through-hole ngoba inomkhondo omncane noma ayinawo nhlobo umkhondo.Ingase ibe nezikhonkwane ezimfushane noma imikhondo yezitayela ezihlukahlukene, othintana nabo abayisicaba, i-matrix yamabhola e-solder (ama-BGA), noma ukunqanyulwa emzimbeni wengxenye.

I-PCB, eyaziwa nangokuthi ibhodi lesifunda eliphrintiwe, iyingxenye ebalulekile ye-elekthronikhi, ukusekelwa kwezingxenye ze-elekthronikhi kanye nomthwali wokuxhunywa kukagesi wezingxenye ze-elekthronikhi.Ngenxa yokuthi yenziwa ngokuphrinta nge-elekthronikhi, ibizwa ngokuthi ibhodi lesifunda "eliphrintiwe".