Ibhodi yokulawula yemojuli entsha ye-SMT SIPLACE TX yomshini wokubeka

Ukukhweza kwe-ASM kuwumgomo ovaliwe wokusebenza. Uma izinga lebhodi ku-mounter lingazinzile, Ngenxa yalokho, inhloko esebenzayo ye-mounter ayikwazi ukubuyela endaweni yokubhekisela, ngakho-ke ayikho indlela yokukhiqiza okuvamile. Imishini ingasebenza ngokujwayelekile kuphela uma inkinga yekhwalithi yebhodi itholakala futhi ilungiswa ngesikhathi sokuqala.

Ubuchwepheshe be-Surface-Mountain (SMT) yindlela lapho izingxenye zikagesi zifakwa khona ngqo phezu kwebhodi lesekethe eliphrintiwe (PCB). ... Ingxenye ye-SMT ivamise ukuba yincane kunozakwabo we- through-hole ngoba inomkhondo omncane noma ayinawo nhlobo.

Ingxenye kagesi efakwe ngale ndlela ibizwa ngokuthi i-surface-mount device (SMD). Embonini, le ndlela ngokuyinhloko ithathe indawo yokwakhiwa kobuchwepheshe bembobo yezingxenye ezifanele, ingxenye enkulu ngoba i-SMT ivumela ukwanda kokukhiqiza okuzenzakalelayo okwehlisa izindleko futhi kuthuthukise ikhwalithi. Iphinde ivumele izingxenye ezengeziwe ukuthi zilingane endaweni ethile ye-substrate. Bobabili ubuchwepheshe bungasetshenziswa ebhodini elifanayo, ngobuchwepheshe be- through-hole obuvame ukusetshenziselwa izingxenye ezingafanele ukukhwezwa ngaphezulu njengama-transformer amakhulu kanye nama-semiconductors amandla acwilisiwe.

Ingxenye ye-SMT ivamise ukuba yincane kunozakwabo we- through-hole ngoba inomkhondo omncane noma ayinawo nhlobo umkhondo. Ingase ibe nezikhonkwane ezimfushane noma imikhondo yezitayela ezihlukahlukene, othintana nabo abayisicaba, i-matrix yamabhola e-solder (ama-BGA), noma ukunqanyulwa emzimbeni wengxenye.

I-PCB, eyaziwa nangokuthi ibhodi lesifunda eliphrintiwe, iyingxenye ebalulekile ye-elekthronikhi, ukusekelwa kwezingxenye ze-elekthronikhi kanye nomthwali wokuxhunywa kukagesi wezingxenye ze-elekthronikhi. Ngenxa yokuthi yenziwe ngokuphrinta nge-elekthronikhi, ibizwa ngokuthi ibhodi lesifunda "eliphrintiwe".